| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a bump structure increasing the joining strength with a board, compared with a conventional structure, and its manufacturing method. <P>SOLUTION: The bump structure 30 is formed to a columnar shape from conductive material, and has a projecting piece 31 protrusively provided in a direction orthogonal to one surface in at least one surface side of the board 40, and a supporting piece 32 supported with the board 40 by penetrating a through-hole 41 prepared in the board 40 to the thickness direction of the board 40. The projecting piece 31 is formed in a so-called mushroom profile in which the diametric size at a base end side is different from the diametric size at a tip end side, so that a head portion 34 at the tip end side is larger than a neck portion 33 at the base end side. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
