| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board that detects an alignment mark reliably and can form a via hole at a precise position corresponding to a conductor circuit. SOLUTION: Resin insulating layers 20, 21, 31, 32 and conductor layers 22, 23, 33, 34 are laminated onto build-up layers 15, 16 arranged on the upper and lower surfaces 13, 14 of a core substrate 12. In the formation process of the conductor layers 19, 22, 33, alignment marks 41, 42 are formed, which comprise a first light reflection section 43 and a second light reflection section 45 for surrounding the first light reflection section 43 while being separated by a removing pattern 44. In a detection process, light for detecting positions is applied to the alignment marks 41, 42 via the resin insulating layers 20, 21, 31, 32, and the alignment marks 41, 42 are detected based on the reflected light. With the alignment marks 41, 42 as position references, the resin insulating layers 20, 21, 31, 32 are irradiated with laser beams to form via holes 25, 27. COPYRIGHT: (C)2009,JPO&INPIT |
