发明名称 CHIP-TYPE SOLID-STATE ELECTROLYTIC CAPACITOR AND MANUFACTURING METHOD THEREOF
摘要 PROBLEM TO BE SOLVED: To solve the problems in a chip-type solid-state electrolytic capacitor having a capacitor element externally provided by resin molding, wherein the capacitor element may be damaged due to the variation in dimension between a piercing body, such as, a pin and the capacitor element in a method of providing an opening piercing from the surface of the exterior resin to the surface of the capacitor element by a method of erecting the pins on a molding die in molding and discharging steam in reflow through the opening, and that sudden discharge of steam at reflow is limited, in a method of providing a steam passage made of a material having high steam permeability, while using exterior resin, in order to discharge the water remaining in the capacitor element. SOLUTION: A laminate having a melting point higher than the resin-molding temperature and lower than the reflow temperature is provided on the resin exterior portion, at the bottom portion of an external terminal plate where the capacitor element is led out. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008270253(A) 申请公布日期 2008.11.06
申请号 JP20070107028 申请日期 2007.04.16
申请人 HITACHI AIC INC 发明人 KITAMURA TAKEHISA
分类号 H01G9/012;H01G9/00 主分类号 H01G9/012
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