| 摘要 |
A light emitting diode includes a base, a light emitting chip, and a wavelength converting layer. The base is formed with a recessed portion that has a bottom wall surface, and a sidewall surface extending upwardly from the bottom wall surface and cooperating with the bottom wall surface to define a receiving space. The light emitting chip is provided on the bottom wall surface of the receiving space, and has a top chip surface disposed below a top surface of the base, and a peripheral chip surface extending downwardly from the top chip surface and being substantially parallel to and forming a gap with the side wall surface of the recessed portion. The wavelength converting layer is filled in the receiving space in the recessed portion so as to cover the top chip surface and the peripheral chip surface of the light emitting chip.
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