| 摘要 |
A lead pin for mounting semiconductor, which does not incline in a reflow process. A void (B) sometimes remains in solder (48) between an electrode pad (44) and a guard (20) of the lead pin for mounting semiconductor, as shown in figure (A). When a reflow process is performed to mount an IC chip, the solder (48) for bonding also melts and the void (B) in the solder expands. As shown in figure (B), since the void goes out to the side along a groove part (24), the guard (20) is raised by the void (B), and the lead pin (10) for mounting semiconductor is prevented from inclining. |
