| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat pipe type heat radiator allowing easy sealing work between itself and the peripheral part of a through hole for mounting the heat radiator in a casing, when mounting it in the casing storing a heating element such as a semiconductor element. <P>SOLUTION: The heat pipe type heat radiator 1 comprises a heating element mounting part 2 of a vertical plate shape, and a heat radiating part 3 of a vertical plate shape formed at the center of the heating element mounting part 2 at a right angle with respect to the heating element mounting part 2 with the upper end extending above the heating element mounting part 2 to present a T shape from a top view. A surface at the opposite side of the heat radiating part 3 side in the heating element mounting part 2 is formed as a flat surface and used as a heating element mounting surface 2A. The heating element mounting part 2 and the heat radiating part 3 have operating fluid filling parts 4, 5 of hollow shapes communicating with each other, and operating fluids are filled in the operating fluid filling parts 4, 5 to form a heat pipe 6. <P>COPYRIGHT: (C)2009,JPO&INPIT |
