| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting diode package excellent in heat dissipation property. <P>SOLUTION: The light emitting diode package includes a lead frame formed by one pair of lead terminals or more, a mold that accommodates a part of the lead frames inside, provides an opened radiation window to radiate light, and further includes one hole or more provided to expose a part of lower surfaces of the lead frames accommodated in the inside, an LED chip mounted on the lead frames positioned inside the mold, an electrode coupling section that electrifies the LED and lead frames, and a molding agent that is filled inside the mold and is composed of any one selected from a transparent epoxy, silicon and a phosphor blends that protect the LED chip and electrode coupling section. <P>COPYRIGHT: (C)2009,JPO&INPIT |
