| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate adsorption device and a substrate conveyance device for surely adsorbing and holding and conveying a substrate such as a conductor wafer by selecting either the upper face or lower face of the substrate as an adsorption face according to the level of the large bending or curvature of the substrate. SOLUTION: A pin set 17 of a wafer adsorption device includes a first absorption means 171 for absorbing and holding a semiconductor wafer from the upper face based on the principle of Bernouilli and a second absorption means 172 for absorbing and holding the semiconductor wafer from the lower face by the suction of open air. COPYRIGHT: (C)2009,JPO&INPIT |
