发明名称 RESIN COMPOSITION, ADHESIVE LAYER AND LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a resin composition capable of enhancing peeling strengths of two films, when the two films are adhered so as to form a laminated film. SOLUTION: The resin composition comprises 20-80 wt.% copolymer (A) described below and 80-20 wt.% copolymer (B) described below. The copolymer (A) is prepared by copolymerizing anα-olefin with a vinyl compound expressed by the following general equation: CH<SB>2</SB>=CH-(CH<SB>2</SB>)<SB>n</SB>-R<SP>1</SP>(I) (wherein n is≥0 integer; R<SP>1</SP>expresses a≥3C alicyclic hydrocarbon group) and the copolymer (B) is a copolymer prepared by copolymerizing ethylene with at least one monomer selected from the group consisting of unsaturated carboxylic acid glycidyl ethers, unsaturated glycidyl ethers and vinyl acetate, or a saponified material from the copolymer. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008266536(A) 申请公布日期 2008.11.06
申请号 JP20070115222 申请日期 2007.04.25
申请人 SUMITOMO CHEMICAL CO LTD 发明人 KUMADA HIROAKI;MIZUNUMA KOJI
分类号 C08L23/08;C09J123/08;C09J123/18;C09J131/04 主分类号 C08L23/08
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