| 摘要 |
<p>The present invention regards a LED module having a LED semiconductor chip (2) mounted directly or indirectly on a platform (3, 3', 3", 3'"). The platform (3, 3', 3", 3''') is being made from silicon and is extending laterally beyond the LED semiconductor chip (2) having an active light emitting layer and a substrate. At least one electronic component which is part of the control circuitry for the LED semiconductor chip (2) is integrated in the silicon platform (3, 3', 3'', 3'").</p> |
