RESIN COMPOSITION, AND PREPREG

摘要

Disclosed is a resin composition comprising, as essential components, 100 parts by mass of an epoxy resin [A], 41 to 80 parts by mass of a thermoplas tic resin particle [B], and 20 to 50 parts by mass (in terms of diaminodiphe nylsulfone) of microencapsulated diaminodiphenylsulfone [C] which is microca psulated with a coating agent, wherein the thermoplastic resin particle [B] comprises at least a thermoplastic resin particle [B1] having an average par ticle diameter of 1 to 50 .mu.m and a thermoplastic resin particle [B2] havi ng an average particle diameter of 2 to 100 .mu.m at a ratio of 3:1 to 1:3 b y mass, and wherein theratio of the average particle diameter (D2) of the th ermoplastic resin particle [B2] to the average particle diameter (D1) of the thermoplastic resin particle [B1] (i.e., a D2/D1 ratio) is 2 or more. Also disclosed is a prepreg produced by using the composition.