| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a high-quality semiconductor device at a low cost while suppressing problems incident to the poor dicing and thinning of a semiconductor chip. SOLUTION: On the element forming surface side of a semiconductor wafer 100 where the formation of elements has finished, a trench 120 is formed along a dicing line and an adhesive tape 24 is stuck to the element forming surface. The semiconductor wafer is made thin by removing the backside and diced at the same time, and the backside of the diced semiconductor wafer is coated with an adhesive 150. Subsequently, the adhesive tape 24 is stripped by being sucked on a holding table 3 having a wafer sucking portion formed of a porous material and separated into a plurality of suction areas. The suction area and suction passage are switched as stripping progresses. After stripping the adhesive tape is completed, each individual semiconductor chip 1 is picked up by means of a suction collet. COPYRIGHT: (C)2009,JPO&INPIT |
