发明名称 HEAT RADIATING APPARATUS FOR ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To achieve improvement of the heat radiation effect by preventing a ceramic substrate on which an LED element is mounted, and a heat sink from being deviated in position, and reducing thermal resistance between the ceramic substrate and the heat sink. SOLUTION: An LED element 11 is electrically connected to circuit patterns 121, 122 of a high heat conductive ceramic substrate 13 on which the circuit patterns 121, 122 are fixed, and is connected to the ceramic substrate 13. The ceramic substrate 13 is fitted to a recess 16 that is formed on a heat sink 14, via an adhesive agent 17. Thus, the LED element 13 is prevented from being deviated in position, so as to prevent deterioration of optical characteristics, and reduction in thermal resistance between the ceramic substrate 13 and the heat sink 14 is attained, thereby attaining improvement of the heat radiation effect. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008270609(A) 申请公布日期 2008.11.06
申请号 JP20070113230 申请日期 2007.04.23
申请人 HARISON TOSHIBA LIGHTING CORP 发明人 KATO TAKEO
分类号 H01L23/36;H01L33/00 主分类号 H01L23/36
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