| 摘要 |
PROBLEM TO BE SOLVED: To provide a thick film circuit board whose periphery of a conductor layer is not delaminated from a base. SOLUTION: A thick film circuit board has a conductor layer conducting electricity formed on an alumina ceramics substrate 1 comprising a conductive paste fired at 600 to 700°C using a powder whose mean particle diameter is 0.1 to 10μm which is a metal powder capable of forming a conductor layer 2 after firing.The periphery 23 of the conductor layer where at least an element is joined is covered with a protection coating film 7 made of glass or resin. COPYRIGHT: (C)2009,JPO&INPIT
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