| 摘要 |
PROBLEM TO BE SOLVED: To achieve a solid-state image pickup device having multilayer interconnections of a peripheral circuit without deteriorating light gathering characteristics and incidence characteristics of oblique light. SOLUTION: The solid-state image pickup device comprises: an imaging region composed of a plurality of pixel cells arranged in a matrix on a semiconductor substrate; and the peripheral circuit that drives the pixel cell and is arranged around the imaging region for processing a signal. The number of wiring layers in the imaging region is smaller than that in the peripheral circuit. In the pixel cell of the imaging region, an in-layer lens is arranged between positions corresponding to the uppermost layer wiring in the imaging region and that in the peripheral circuit around the wiring, and an on-chip color filter and an on-chip lens are arranged above the position corresponding to the uppermost layer wiring of the peripheral circuit. COPYRIGHT: (C)2009,JPO&INPIT
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