发明名称 |
Same Size Through-Hole Via Die Stacked Package |
摘要 |
A semiconductor package includes a substrate or leadframe structure. A plurality of interconnected dies, each incorporating a plurality of through-hole vias (THVs) disposed along peripheral surfaces of the plurality of dies, are disposed over the substrate or leadframe structure. The plurality of THVs are coupled to a plurality of bond pads through a plurality of a metal traces. A top surface of a first THV is coupled to a bottom surface of a second THV. An encapsulant is formed over a portion of the substrate or leadframe structure and the plurality of dies.
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申请公布号 |
US2008272470(A1) |
申请公布日期 |
2008.11.06 |
申请号 |
US20070768869 |
申请日期 |
2007.06.26 |
申请人 |
STATS CHIPPAC, LTD. |
发明人 |
DO BYUNG TAI;KUAN HEAP HOE;CHOW SENG GUAN |
分类号 |
H01L21/4763;H01L21/00;H01L23/48;H01L23/495 |
主分类号 |
H01L21/4763 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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