LEADFRAME CONFIGURATION TO ENABLE STRIP TESTING OF SOT-23 PACKAGES AND THE LIKE
摘要
A sacrificial lead and a common lead hold a die paddle of each integrated circuit SOT-23 package to a leadframe within a strip of leadframes after isolating signal leads from the leadframe. Strip testing of most devices in the SOT-23 three and five lead packages may then be performed. The common lead may be at the center of an edge of the SOT-23 package. Also the common lead may be any one of the leads of the SOT-23 package. In addition the sacrificial lead may be at the center of an opposite edge of the SOT-23 package.
申请公布号
WO2008134426(A2)
申请公布日期
2008.11.06
申请号
WO2008US61418
申请日期
2008.04.24
申请人
MICROCHIP TECHNOLOGY INCORPORATED;DRWINGA, RANDALL, L.;WILKIE, DAVID, L.