| 摘要 |
PROBLEM TO BE SOLVED: To provide a gelatinous plating composition which is used in electroplating and electroless plating for applying a thin coating film of a metal such as copper, nickel or gold or a composite metal of these metals on the surface of a metal or a nonmetal and which has excellent stability, allows a uniform metal coating film to be formed, and is suitable for partial plating. SOLUTION: The gelatinous plating composition contains at least a plating solution, a gelling agent, a hardness adjusting agent, and a plating surface adjusting agent, and is characterized in that the pH is 2.0-7.5, and the gel strength is 100-900 g/cm<SP>2</SP>at a temperature of 20-80°C. COPYRIGHT: (C)2009,JPO&INPIT
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