发明名称 METHOD AND APPARATUS FOR FORMING METAL THIN FILM ON BASE MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a method for forming a metal thin film on a base material, by which a metal thin film having a low specific resistance can be formed. SOLUTION: The method for forming a metal thin film on a base material comprises forming the metal thin film on the base material by using a plating solution containing a reductant for reducing the ions of a metal. In the method, as the reductant, a first reductant having a reducing ability to the ions of the metal and forming particles of the metal and a second reductant having a reducing ability to the ions of the metal and depositing the metal on the surface of each particle as a nucleus are used. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008266689(A) 申请公布日期 2008.11.06
申请号 JP20070108671 申请日期 2007.04.17
申请人 SHARP CORP 发明人 OGAKI HISASHI
分类号 C23C18/31;H01L21/288 主分类号 C23C18/31
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