发明名称 |
CHEMICAL MECHANICAL POLISHING AGENT KIT AND CHEMICAL MECHANICAL POLISHING METHOD USING THE SAME |
摘要 |
A chemical mechanical polishing method of the present invention comprises conducting polishing by the use of a chemical mechanical polishing aqueous dispersion (A) containing abrasive grains and then conducting polishing by the use of a chemical mechanical polishing aqueous composition (B) containing at least one organic compound having a heterocyclic ring in addition to the chemical mechanical polishing aqueous dispersion (A). Also A chemical mechanical polishing agent kit of the present invention comprises the chemical mechanical polishing aqueous dispersion (A) and the chemical mechanical polishing aqueous composition (B). The polishing method and the polishing agent kit can prevent an increase of dishing and corrosion of wiring portion to enhance the yield.
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申请公布号 |
US2008274620(A1) |
申请公布日期 |
2008.11.06 |
申请号 |
US20080164320 |
申请日期 |
2008.06.30 |
申请人 |
JSR CORPORATION |
发明人 |
SHIDA HIROTAKA;KONNO TOMOHISA;HATTORI MASAYUKI;KAWAHASHI NOBUO |
分类号 |
B24D3/20;H01L21/302;C09G1/02;C09K3/14;H01L21/321 |
主分类号 |
B24D3/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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