| 摘要 |
<p>The present invention relates to an electrically conductive composition for filling via-holes formed in an electronic circuit substrate containing an electrically conductive metal and a vehicle, wherein the content of the electrically conductive metal is 57 vol% or more, and the composition is a plastic fluid for which fluidity increases when external pressure is applied to the composition. The object of the invention is to eliminate the entrapment of air from the via-holes.</p> |
