发明名称 HOUSING FOR A LIGHT-EMITTING DIODE COMPONENT, AND A LIGHT-EMITTING DIODE COMPONENT
摘要 A housing (1) is specified for a light-emitting diode component (2), having a housing cavity (11) within which at least one chip mounting area (33) for a light-emitting diode chip (3) is arranged, and which has an outlet opening (12). According to one embodiment, the housing (1) has inner walls at least at a vertical distance from the chip mounting area (33), which bound the housing cavity (11) at the side and are at a maximum lateral distance (14, 15) of less than or equal to 500 mum from the chip mounting area (33). Furthermore, a housing (1) is specified in which the housing cavity (11) has at least one subarea (13) which is covered laterally by a housing material (17) which bounds the housing cavity (11) at the sides. Furthermore, a light-emitting diode component (2) is described, in particular for a motor-vehicle headlight.
申请公布号 KR20080097444(A) 申请公布日期 2008.11.05
申请号 KR20087021447 申请日期 2007.01.24
申请人 OSRAM OPTO SEMICONDUCTORS GMBH 发明人 ENGL MORITZ;REILL JOACHIM;WULLER MARTIN;SCHWENKSCHUSTER LUKAS
分类号 H01L33/50;H01L33/60 主分类号 H01L33/50
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