发明名称
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic part mounting device capable of mounting electronic parts on a substrate with excellent workability and at a high speed using a plurality of electronic part mounting devices and changing a layout with flexibility corresponding to a change in the type of a substrate. <P>SOLUTION: The device comprises a base 10, a conveyance path 11 of a substrate 8 provided on the base 10, an XY table mechanism provided in the X direction and Y direction when seen as a top plan view above the base 10, a head 30 having a plurality of nozzles provided in the XY table mechanism and mounting electronic parts on the substrate 8, an electronic part supply section 20 provided at the side of the conveyance path 11 of the substrate 8 for supplying the electronic parts to the head 30, and a recognition unit for recognizing the electronic parts absorbed by a vacuum to the plurality of nozzles, wherein the recognition unit is caused to take in images two by two simultaneously of the electronic parts absorbed by the vacuum to the nozzles arranged in the Y direction among the electronic parts absorbed by the vacuum to the plurality of nozzles. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP4175335(B2) 申请公布日期 2008.11.05
申请号 JP20050087866 申请日期 2005.03.25
申请人 发明人
分类号 H05K13/04;H05K13/08 主分类号 H05K13/04
代理机构 代理人
主权项
地址