| 摘要 |
A method of manufacturing an antenna. First and second laminate stackups are provided. Each stackup comprises laminated layers of conductive and dielectric materials stacked together to form a multi-layer board. A heatsink is coupled to the first laminate stackup. A thermally conductive standoff is coupled to the heatsink. An integrated circuit (IC) is coupled to the standoff such that the standoff is disposed between the heatsink and the IC, and the standoff provides heat conduction between the IC and the heatsink. The first laminate stackup is combined with the second laminate stackup to define an enclosed space therebetween in which the IC and the standoff are located. A plurality of antenna apertures are coupled to a bottom side of the second laminate stackup.
|
