摘要 |
The invention relates to an optoelectronic component, having a semiconductor chip ( 1 ) which is mounted on a flexible chip support ( 6 ), in which conductor tracks ( 3, 5 ) for electrically connecting the semiconductor chip ( 1 ) are embodied on a first main face, and on which a housing frame ( 7 ) is disposed that is filled with a radiation-permeable medium, in particular a filler compound. A display device, an illumination or backlighting device, and a method for producing components of the invention are also disclosed.
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