发明名称 |
Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same |
摘要 |
Alignment precision enhancement of electronic component process on flexible substrate device and method thereof the same is proposed. The process step of a flexible substrate is put on a substrate holder, wherein the flexible substrate is fixed by a polymer tape. A plural of alignment marks is making for lithography process. An unstressed cut is separated the flexible substrate and substrate holder when the electronic component is made.
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申请公布号 |
US7444733(B2) |
申请公布日期 |
2008.11.04 |
申请号 |
US20050289356 |
申请日期 |
2005.11.30 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
HO JIA-CHONG;HU TARNG-SHIANG;CHENG HSIANG-YUAN |
分类号 |
H01S4/00;G01R3/00;H05K3/02;H05K3/30 |
主分类号 |
H01S4/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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