发明名称 |
Compression connection for vertical IC packages |
摘要 |
An improved vertical integrated circuit device package that eliminates or reduces the need for wire bond connections and/or solder connections is provided. The package includes a vertical device having electrodes on opposite surfaces, and a compressed spring member that is used to establish compression electrical connections between the electrodes and corresponding electrically conductive elements. |
申请公布号 |
US7447041(B2) |
申请公布日期 |
2008.11.04 |
申请号 |
US20070712718 |
申请日期 |
2007.03.01 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
BRANDENBURG SCOTT D.;DEGENKOLB THOMAS A.;YEH SHING |
分类号 |
H05K7/00 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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