ADHEISIVE RESIN COMPOSITION AND DICING DIE BONDING FILM USING THE SAME

摘要

An adhesive resin composition for a semiconductor device is provided to reduce a failure rate of processes due to excellent the adhesiveness to a wafer in a semi-hardened state and excellent coverage, and to manufacture a semiconductor device with a superior reliability due to excellent heat resistance, moisture absorption resistance and reflowcrack resistance in a hardened state. An adhesive resin composition comprises (a) a polyfunctional epoxy resin; (b) a phenol resin in which the moisture absorption rate in 48 hour processing under the conditions of 121deg.C, 2 pressure(atm) and 100%RH is 2.0 wt.%; and (c) a thermosetting resin. The average epoxy equivalent of polyfunctional epoxy resin is 180-1000.