HIGHLY RELIABLE LOW COST STRUCTURE FOR WAFER-LEVEL BALL GRID ARRAY PACKAGING

摘要

A structure for a wafer-level ball grid array packaging is provided to reduce the size of package and perform the manufacturing process tightly. A method for manufacturing an integrated circuit package includes the step of providing a wafer having a plurality of integrated circuit region(1500); the step of forming the insulating layer(1502) on the wafer; the step of forming a plurality of vias(1504a) through the insulating layer in order to provide the access toward a plurality of terminal(604a) of each integrated circuit region; the step of forming a plurality of routing interconnects on the insulating layer.