发明名称 |
Chip receptacle, method for fabricating a chip receptacle and chip transport container |
摘要 |
Cavities for holding semiconductor chips are etched anisotropically into a semiconductor wafer. An orientation of the wafer in the (100) pulling direction results in geometrically exactly etched sidewalls of the cavities with an angle of 125.3°. What is thereby achieved is that chips can slip into the cavity with a low risk of damage. A transparent cover plate is situated on the cavity plate.
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申请公布号 |
US7445119(B2) |
申请公布日期 |
2008.11.04 |
申请号 |
US20040834754 |
申请日期 |
2004.04.29 |
申请人 |
OSRAM OPTO SEMICONDUCTORS GMBH |
发明人 |
KAEMPF MATHIAS;SINGER FRANK;DACHS JURGEN;BACHLER ALFRED |
分类号 |
B65D85/86;B65D85/90;B65G49/05;C23F1/00;H01L21/673 |
主分类号 |
B65D85/86 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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