发明名称 METHOD FOR MOUNTING ELECTRONIC COMPONENT ON FLEXIBLE PRINTED CIRCUIT AND PRESSURE SENSITIVE ADHESIVE SHEET FOR FIXING FLEXIBLE PRINTED CIRCUIT
摘要 A flexible printed wiring board(4)is fixed to a pressure−sensitive adhesive layer of a fixing sheet(6),and an electronic part is mounted on the flexible printed wiring board(4).Alternatively,an adhesive sheet(5)is bonded to the opposite side to the side,where an electronic part is to be mounted,of the flexible printed wiring board(4),the flexible printed wiring board is fixed to the fixing sheet(6)through the adhesive sheet(5),and an electronic is mounted on the flexible printed wiring board(4).The adhesive sheet(5)for fixing the flexible printed wiring board(4)to the fixing sheet(6)has a pressure−sensitive layer at least on one side of its porous base.The storage elastic modulus(frequency:1 Hz)of the pressure−sensitive adhesive layer lies in a range of 10<sp>3</sp> to 10<sp>6</sp> Pa at 0 to 300°C.Projections or dents can be formed on or in the pressure−sensitive adhesive layer.
申请公布号 KR100867048(B1) 申请公布日期 2008.11.04
申请号 KR20037013689 申请日期 2003.10.18
申请人 发明人
分类号 H05K3/32 主分类号 H05K3/32
代理机构 代理人
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