发明名称 COOLING STRUCTURE OF POWER SEMICONDUCTOR DEVICE AND INVERTER
摘要 A cooling structure of a power semiconductor element is provided with a cooling water channel (26) and a plurality of fins (22). In the cooling water channel (26), cooling water for cooling the power semiconductor element flows. The fins (22) are arranged on the cooling water channel (26) at intervals in a direction orthogonally intersecting with the flow direction of the cooling water. The fins (22) promote heat exchange between the power semiconductor element and the cooling water. The fins (22) have ends (41) facing the upstream of the cooling water flow. The end (41) of at least one fin (22) among the fins (22) is arranged by being shifted to the upstream of the cooling water flow from the end (41) of the adjacent fins (22) on the both sides of the fin (22). Thus, the cooling structure of the power semiconductor element having excellent cooling efficiency and an inverter are provided.
申请公布号 KR20080096806(A) 申请公布日期 2008.11.03
申请号 KR20087021340 申请日期 2008.08.29
申请人 TOYOTA JIDOSHA KABUSHIKI KAISHA 发明人 SHIBA KENJIRO
分类号 H02M7/48 主分类号 H02M7/48
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