发明名称 METHOD FOR PRODUCING AN ELECTRICAL CIRCUIT
摘要 AN ELECTRICAL CIRCUIT IS FORMED BY FORMING AND PATTERNING A CONDUCTIVE LAYER ON A SUBSTRATE , FORMING AND PATTERNING A CONDUCTIVE LAYER ON ANOTHER SUBSTRATE, DEPOSITING A DIELECTRIC LAYER ON AT LEAST A PORTION OF ONE OF CONDUCTIVE LAYERS, MOUNTING AN INTEGRATED CIRCUIT (IC) BETWEEN THE SUBSTRATES, COUPLING THE IC TO THE CONDUCTIVE LAYERS, AND AFFIXING THE SUBSTRATES TOGETHER WITH THE CONDUCTIVE LAYERS BETWEEN THE SUBSTRATES. THESE ARE IEHTER SEPARATE SUBSTRATES OR A UNITARY SUBSTRATE. THE IC MOUNTED IETHER TO A SUBSTRATE, A CONDUCTIVE LAYER, OR A DIELECTRIC LAYER. THE IC IS COUPLED TO THE CONDUCTIVE LAYERS EITHER DIRECTLY OR THROUGH OPENINGS FORMED IN THE DIELECTRIC LAYER. AN INTERIOR CONDUCTIVE LAYER MAY BE USED TO COUPLED THE IC TOTHE CONDUCTIVE LAYERS.
申请公布号 MY136587(A) 申请公布日期 2008.10.31
申请号 MYPI20031583 申请日期 2003.04.25
申请人 ALCOA CLOSURE SYSTEMS INTERNATIONAL, INC. 发明人 DERBENWICK, GARY F.;DEVILBISS, ALAN D.
分类号 G06K19/077;H01L;H01L21/44;H01L23/34;H01L23/498;H05K1/18;H05K5/00 主分类号 G06K19/077
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