| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a treatment kit that reduces the deposition of a depositant material on inside chamber constituent members and on the protruded edge of a substrate. <P>SOLUTION: The treatment kit 200 comprises a shield 201 and a ring assembly 202 each positioned around the circumference of a substrate holder in a treatment chamber, wherein the shield 201 is provided with a cylindrical band 214 having an upper wall part that surrounds a sputtering target and a bottom wall part that surrounds a U-shaped channel having the substrate holder, a supporting protrusion, a slanted step part, and a gas conductance hole part, the ring assembly 120 is provided with a deposition ring 208 and a covering 212, and the covering 212 has a valve-type protrusion around the circumference of the ring. <P>COPYRIGHT: (C)2009,JPO&INPIT |
