发明名称 ORGANIC WIRING SUBSTRATE FOR MOUNTING LIGHT EMITTING DEVICE AND ITS MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide an organic wiring substrate for mounting light emitting device that can improve the light emitting efficiency of a light emitting device to be mounted and can be appropriately connected to the mounted light emitting device or the connection terminals of external devices, and to provide its manufacturing method. <P>SOLUTION: The organic wiring substrate is provided with a substrate main body 2 comprised of an organic substrate, a light emitting device mounting part 20 that is formed in the substrate main body 2 and to which a light emitting device is mounted, and a solder connection part 30 that is formed in the substrate main body 2 and to which at least either of the light emitting device mounted to the light emitting device mounting part 20 and an external connection terminal is electrically connected by solder. The surface member of the light emitting device mounting part 20 is made of silver, and that of the solder connection part 30 is made of gold. <P>COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2008262960(A) 申请公布日期 2008.10.30
申请号 JP20070102527 申请日期 2007.04.10
申请人 DAISHO DENSHI:KK 发明人 OWAKI TOSHIO;IMAMURA EIJI;KOYAMA MITSURU
分类号 H01L33/62;H05K1/02;H05K3/06;H05K3/34 主分类号 H01L33/62
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