| 摘要 |
PROBLEM TO BE SOLVED: To provide a connection structure of mutual transmission lines which can suppress signal interface to a peripheral semiconductor element, wiring circuit or the like. SOLUTION: A transmission line substrate for connection having a ground pattern where two slot holes electromagnetic-coupled to a triplate line are formed is connected to first and second transmission line substrates having a ground pattern where slot holes electromagnetic-coupled to the triplate line are formed, and the slot holes are opposed to each other, so that a high frequency signal can be transmitted between the first and second transmission line substrates. COPYRIGHT: (C)2009,JPO&INPIT
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