| 摘要 |
A manufacturing method of an electronic component, characterized by having a first step of forming a treated substrate with a reinforcing part having a treated substrate body and a reinforcing part of the treated substrate body standing on a first principal surface of the treated substrate body, a second step of forming a first conductive pattern on the side of the first principal surface of the treated substrate body and forming a second conductive pattern on the side of a second principal surface of the treated substrate body, respectively, and a third step of cutting the treated substrate body and eliminating the reinforcing part and also dividing the treated substrate body into individual pieces.
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