发明名称 |
Modular Sub-Assembly of Semiconductor Strips |
摘要 |
A modular subassembly ( 100 ) of elongated semiconductor strips ( 110 ) and a method of making the same are disclosed. Supporting media ( 120 ) supports the elongated semiconductor strips ( 110 ). Elongated semiconductor strips ( 110 ) are disposed on and affixed to the supporting media ( 120 ). The supporting media ( 120 ) may be configured in a number of ways.
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申请公布号 |
US2008264465(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20060883083 |
申请日期 |
2006.01.27 |
申请人 |
KERR MARK JOHN;VERLINDEN PIERRE JACQUES |
发明人 |
KERR MARK JOHN;VERLINDEN PIERRE JACQUES |
分类号 |
H01L31/042 |
主分类号 |
H01L31/042 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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