发明名称 Modular Sub-Assembly of Semiconductor Strips
摘要 A modular subassembly ( 100 ) of elongated semiconductor strips ( 110 ) and a method of making the same are disclosed. Supporting media ( 120 ) supports the elongated semiconductor strips ( 110 ). Elongated semiconductor strips ( 110 ) are disposed on and affixed to the supporting media ( 120 ). The supporting media ( 120 ) may be configured in a number of ways.
申请公布号 US2008264465(A1) 申请公布日期 2008.10.30
申请号 US20060883083 申请日期 2006.01.27
申请人 KERR MARK JOHN;VERLINDEN PIERRE JACQUES 发明人 KERR MARK JOHN;VERLINDEN PIERRE JACQUES
分类号 H01L31/042 主分类号 H01L31/042
代理机构 代理人
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