发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
A semiconductor device is disclosed, which comprises a semiconductor element in which a laminated film composed of a plurality of layers including an insulating film is formed on a surface of a semiconductor substrate, and a portion of the laminated film is removed from the surface of the semiconductor substrate so that the semiconductor substrate is exposed at the portion, a mounting substrate on which the semiconductor element is mounted, and a resin layer which seals at least a surface side of the semiconductor element with resin.
|
申请公布号 |
US2008265443(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
US20080213766 |
申请日期 |
2008.06.24 |
申请人 |
KABUSHIKI KAISHA TOSHIBA, |
发明人 |
IMOTO TAKASHI;TAKUBO CHIAKI;HOSOKAWA RYUJI;IMORI YOSHIHISA;SATO TAKAO;KUROSAWA TETSUYA;KIRITANI MIKA |
分类号 |
H01L23/28;H01L21/00;H01L21/48;H01L23/31;H01L23/48;H01L23/522;H01L23/532 |
主分类号 |
H01L23/28 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|