| 摘要 |
Hot melt adhesive compositions which have enhanced adhesion to difficult substrates, particularly at refrigerator/freezer temperatures or at elevated temperatures. The inventive compositions require a base polymer comprising at least one metallocene ethylene-containing polymer or at least one non-metallocene, amorphous, propylene containing polymer; a tackifier; an optional wax; and an adhesion promoting additive comprising at least one semi-crystalline polymer having a weight average molecular weight of about 30,000 daltons or less. It has been found that the adhesion promoting additive of this invention enhances the adhesion properties of a hot melt adhesive composition having a metallocene ethylene-containing base polymer or non-metallocene, amorphous, propylene containing base polymer, particularly at elevated temperatures or at low refrigerator and freezer temperatures where other conventional adhesives have been unsuccessful.
|
