| 摘要 |
A photosensitive resin composition is provided to form a hard resin pattern having excellent solvent resistance and heat resistance with a high resolution. A photosensitive resin composition comprises a binder component(A) and a photopolymerization initiator(B). The binder component comprises a photopolymerizable compound(A1) having at least one carboxyl group and at least two unsaturated bonds capable of performing and a photopolymerizable compound(A2) without a carboxyl group. The average molecular weight of the binder component is 1,500 or less. |
