| 摘要 |
A laser fabricating method and a laser fabricating apparatus are provided to reduce the quantity of light penetrating a transparent body and to improve the processing efficiency while processing at the high precision to the surface of the transparent body such as a semiconductor substrate. a laser fabricating apparatus comprises a laser generating unit(1) generating a first laser which is the ultra short pulse having a first wave length; a wavelength conversion unit(5) changing to a second laser which is the ultra short pulse having the second wavelength which is a part of the energy of the first laser, the high frequency, of the first wave length; a delay generating unit(19) giving the time delay the first laser to the second laser; a light collecting unit(16) condensing the first laser and the second laser on coaxial.
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