| 摘要 |
The film formation method is provided to obtain a multilayered film distributed at the one-direction of substrate having the slope rate of film thickness given. The sputtering film formation method includes a step for forming a film on the surface of the substrate(10), which a target is set slantly on a surface of the substrate while the substrate rotates about the perpendicular axis about the substrate surface target, and a step for finishing the formation of film in the predetermined timing from the formation initiation of film and the formation of film is terminated when the substrate rotates as 360 the x n +180 + alpha. Here, it is the natural number including N is 0. -10 is < alpha < 10 degree.
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