| 摘要 |
PROBLEM TO BE SOLVED: To increase overall operation efficiency of a semiconductor memory inspection device by obtaining only necessary fail information from a fail memory to transfer and store it in an external storage device. SOLUTION: The semiconductor memory inspection device configured to obtain fail information of a measuring target semiconductor memory 10 stored in a fail memory to transfer and store it in an external storage device 24 is provided with a static acquisition condition setting section for setting common information as a static acquisition condition irrespective of test items of a measuring target semiconductor memory, and a dynamic acquisition condition setting section for setting information varied from one test item to another of the measuring target semiconductor memory as a dynamic acquisition condition. COPYRIGHT: (C)2009,JPO&INPIT
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