| 摘要 |
An object of the present invention is to provide a semiconductor device by packaging a plurality of semiconductor chips three-dimensionally in a smaller thickness, with a smaller footprint, at the lower cost without using any other components and through a simpler manufacturing process of the semiconductor device than with the conventional methods. A flip chip packaging structure is formed by directly connecting a first semiconductor chip ( 101 ) reduced in thickness by back grinding and a substrate ( 105 ) via a bump electrode ( 102 ) to a wiring pattern ( 106 ). Also, a second semiconductor chip ( 103 ) is formed with an electrode ( 104 ) that is higher than the sum of the thickness of the first semiconductor chip ( 101 ) and the height of the electrode ( 102 ), and the electrode ( 104 ) is directly connected to the wiring pattern ( 106 ) on the substrate ( 105 ), whereby the most-compact three-dimensional semiconductor packaged device is produced.
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