发明名称 |
SEMICONDUCTOR CHIP AND HIGH FREQUENCY CIRCUIT |
摘要 |
A semiconductor chip in which a reflection circuit, a demultiplexer circuit, a matching circuit, and he like, being connected to the chip end can be made to function sufficiently. A semiconductor chip having wiring patterns (12, 14) provided on a semiconductor substrate on which at least one semiconductor element (11) is formed and being connected with respective terminals of the semiconductor element (11), and electrode pads (13, 15) connected with the wiring patterns (12, 14) and connecting the semiconductor substrate with a signal I/O circuit formed on other substrate is further provided with parallel wiring patterns (16, 18) being connected with the wiring patterns (12, 14) at at least one terminal end of the semiconductor element, and electrode pads (17, 19) connected with the parallel wiring patterns (16, 18) and electrically connecting a reactance circuit formed on the other substrate separately from the signal I/O circuit. |
申请公布号 |
WO2008129713(A1) |
申请公布日期 |
2008.10.30 |
申请号 |
WO2007JP72211 |
申请日期 |
2007.11.15 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION;SUZUKI, TAKUYA;KAWAKAMI, KENJI;KANAYA, KO;KITAMURA, YOICHI |
发明人 |
SUZUKI, TAKUYA;KAWAKAMI, KENJI;KANAYA, KO;KITAMURA, YOICHI |
分类号 |
H03D7/02;H01L21/822;H01L27/04 |
主分类号 |
H03D7/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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