CONNECTING MICROSIZED DEVICES USING ABLATIVE FILMS
摘要
A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.
申请公布号
WO2008130493(A2)
申请公布日期
2008.10.30
申请号
WO2008US04406
申请日期
2008.04.04
申请人
EASTMAN KODAK COMPANY;ALI, MOHAMMAD ZAKI;STOLT, PETER AXEL;HAWKINS, GILBERT ALLEN;STEPHANY, THOMAS MICHAEL
发明人
ALI, MOHAMMAD ZAKI;STOLT, PETER AXEL;HAWKINS, GILBERT ALLEN;STEPHANY, THOMAS MICHAEL