发明名称 Method for determination of soldering profile with rework of conductor board, involves heating housing of sample element with hot-air equipment for determination of temperature distribution
摘要 <p>The method involves heating housing of a sample element (2) with hot-air equipment (5) for the determination of the temperature distribution. The temperature of the housing of the sample element is determined with an arranged temperature sensor (3) at the housing of the sample element in such a manner, that during a rise phase for reaching a permissible temperature for the housing of the sample element is not exceeded to a permissible temperature gradient of the sample element.</p>
申请公布号 DE102007019116(A1) 申请公布日期 2008.10.30
申请号 DE20071019116 申请日期 2007.04.23
申请人 MARTIN GMBH 发明人
分类号 H05K3/34;G01N25/00 主分类号 H05K3/34
代理机构 代理人
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