| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting condition determining method capable of setting a proper mounting condition for every kind of mounting substrates. <P>SOLUTION: The mounting condition determining method includes a deriving step S104 of deriving a common mounting condition for producing mounting substrates of a plurality of kinds of substrates; a tact specifying step S106 of specifying a tact for every kind of substrates when a component mounting machine packages a component in conformity with its mounting condition; a judging step S108 of judging, for every kind of substrates, whether or not the specified tact is shorter than a predetermined target time for the kind of its substrate; alteration steps S110, S104 of altering the foregoing mounting conditions such that the tact judged to be not shorter than the target time gets shorter; and a determining step S112 of determining the altered mounting condition as a final mounting condition. <P>COPYRIGHT: (C)2009,JPO&INPIT |
