| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a printed wiring board having sufficient insulative reliability even if it is subjected to microfabrication by excellently executing the etching treatment of a dual layer flexible wiring board having an Ni-Ti-Mo alloy provided on a base metal layer. SOLUTION: In the manufacturing method of the printed wiring board, a base metal layer containing titanium, molybdenum and nickel is directly formed on at least one surface of an insulator film without interposing an adhesive, and a pattern is formed by an etching method on the dual layer flexible wiring board having a copper coated layer on the base metal layer. This method has: a step of etching the dual layer flexible board with a solution of a ferrous chloride or a cupric chloride containing a hydrochloric acid; a step of treating the obtained dual layer flexible board with an oxidic etching solution containing a hydrochloric acid; and a step of treating the dual layer flexible board with an alkaline etching solution containing potassium ferricyanide or permanganate. COPYRIGHT: (C)2009,JPO&INPIT
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